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Four HKSTP companies receive CES innovation awards

Pic Credit : HKSTP, Press Release

According to a recent press release, the Hong Kong Science and Technology Parks Corporation (HKSTP) announced that four Hong Kong Science Park companies received the CES Innovation Awards for next year’s Consumer Electronics Show (CES) 2019, to be held in January.

CES 2019 is known as the world’s largest consumer electronics show, held annually in Las Vegas, USA.

The four companies received the awards include three Park companies.

The Product Director of one of the products stated that his team constantly seeks innovative ideas and solutions that can make people live smarter and stay healthier. The company is very excited that its Capsulier LITE received this award, a recognition of its overall appeal to consumers. He noted that there were various challenges during its product development but thanks to HKSTP support and guidance, finally the company was able to bring the product to the market.

The CEO & Co-Founder of the second winning company stated that their team is grateful for the opportunity to participate in the upcoming CES 2019 cohort organised by HKSTP, without which their company’s technology would not have won the international recognition. He added that the team’s innovation is pioneering a new way people view and interact with touchscreen-based smart devices; their patented EFM™ technology makes previously impractical consumer applications possible by a simple tap.

He noted that the company looks forward to showcasing the advantages of their product and technology at next year’s CES in front of a global audience.

Then, the Technical Manager of the third winning company stated that it is very excited to have two of its technologies selected as Honoree winners for the CES 2019 Innovation Awards. The company’s self-powered flexible printed circuit board, or FPCB, is produced by printing  a solid-state rechargeable lithium battery directly on the board itself, resulting in a self-powered all-in-one component for electronics.

The TM noted that this is the first time such an approach is done for electronic components. The other awarded technology is the company’s thin, light-weight printed pressure sensor with high flexibility and low cost which can be customised for various applications and products. This achievement reaffirms its continuous efforts in technological research to produce commercially viable solutions for the industry, and the result of the trust from its industry partners and support by HKSTP.

Finally, the Chief Technology Officer of the fourth winning company stated that it is an honour to be recognised for their work in applying open source technologies to enhance personal cybersecurity for travellers. He added that the company is proud to be named a CES 2019 Innovation Awards honoree, further validating its ability to deliver a smarter solution to secure today’s wireless devices.

He added that the company looks forward to delivering even more solutions for IoT devices in the future, as cybersecurity gets increasingly more complicated over time.

The 2019 CES Innovation Awards that accompanies the main CES show celebrates outstanding product design and engineering in brand-new consumer technology products in 28 award categories based on engineering qualities, aesthetic and design qualities, function and user value, its uniqueness as well as the positive impact to the quality of life.

The Chief Executive Officer of HKSTP stated HKSTP is particularly encouraged that there are four companies from Science Park receiving the Innovation Awards at CES, the largest consumer electronics show in the world. The CES event is a showcase to the international community of what innovations from Hong Kong can produce from its shores. It is an affirmation of HKSTP’s R&D capabilities and ability to create products that are commercially viable.

HKSTP also will bring 10 Science Park companies to next year’s event, to present some of the best of Hong Kong’s innovations at the Eureka Park – the global stage for start-ups at CES 2019 in Las Vegas, USA.

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