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Singapore Pioneering High-Power Device Efficiency

Image credit: ntu.edu.sg
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The technology landscape constantly seeks high-power, energy-efficient devices. 3D-stacked electronics offer exciting potential, but overheating is a challenge due to their compact design. Excess heat can cause performance issues and damage. Thankfully, a new solution involving magnetic fields and innovative materials has emerged to address this challenge, ensuring these devices remain cool and efficient.

At the forefront of this breakthrough is a team of scientists led by Assistant Professor Hortense Le Ferrand of the Nanyang Technological University of Singapore – School of Mechanical and Aerospace Engineering. They have embarked on a journey to tame the heat generated by 3D-stacked electronics and ensure they operate at peak performance.

The key to their innovation lies in a material called hexagonal boron nitride (BN), known for its exceptional heat-dissipating properties. To make BN responsive to their needs, the researchers coated microscopic BN particles with iron oxide. This strategic move rendered the particles magnetic, paving the way for precise control.

Next, they suspended these coated particles in a solvent and brought magnetic fields into play. The magic happened as the magnetic fields aligned the BN particles in various orientations. This alignment turned out to be the key to effective heat management.

The team conducted rigorous tests to gauge the heat-dissipating capabilities of these precisely oriented BN particles. What they discovered was nothing short of revolutionary: when the particles were aligned vertically, they proved incredibly efficient at channelling heat away from their source. This breakthrough alone promised a significant leap forward in the cooling technology of high-power devices.

But the innovation didn’t stop there. The orientation of the particles could also be tailored to direct heat in different directions, a flexibility that opens a world of possibilities. For instance, when these particles find themselves sandwiched between two heat-emitting electronic components, they can be configured to direct heat sideways, ensuring optimal thermal management.

Assist Prof Hortense believes this novel approach to aligning and orienting BN particles offers exciting new prospects for managing heat in high-power electronic devices. It’s a promising development that could pave the way for the widespread adoption of 3D-stacked electronics, ushering in an era of high-performance, energy-efficient devices without the nagging concern of overheating.

Preventing high-power devices ensures sustained performance. Overheating can cause these devices to throttle their performance or even shut down altogether. This can have a significant impact on productivity and functionality, especially in critical applications.

Further, managing heat is crucial for the longevity of these devices. Excessive heat can damage internal components over time, leading to a shorter lifespan. This, in turn, can result in frequent replacements, which can be costly for both consumers and manufacturers.

Besides, there are safety concerns associated with overheating. In extreme cases, it can pose a fire hazard or create electrical safety risks. Proper heat management is vital to mitigate these dangers and ensure the safe operation of high-power devices.

Efficient cooling also contributes to energy efficiency. When devices operate within their optimal temperature range, they consume less power. This not only reduces energy costs but also lessens the environmental impact.

Also, reliable operation is paramount for high-power devices, particularly in critical applications like medical equipment and aerospace technology. Overheating can lead to system failures, which may have severe consequences; hence, effective heat management is crucial to maintain the reliability of these devices.

PARTNER

Qlik’s vision is a data-literate world, where everyone can use data and analytics to improve decision-making and solve their most challenging problems. A private company, Qlik offers real-time data integration and analytics solutions, powered by Qlik Cloud, to close the gaps between data, insights and action. By transforming data into Active Intelligence, businesses can drive better decisions, improve revenue and profitability, and optimize customer relationships. Qlik serves more than 38,000 active customers in over 100 countries.

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CTC Global Singapore, a premier end-to-end IT solutions provider, is a fully owned subsidiary of ITOCHU Techno-Solutions Corporation (CTC) and ITOCHU Corporation.

Since 1972, CTC has established itself as one of the country’s top IT solutions providers. With 50 years of experience, headed by an experienced management team and staffed by over 200 qualified IT professionals, we support organizations with integrated IT solutions expertise in Autonomous IT, Cyber Security, Digital Transformation, Enterprise Cloud Infrastructure, Workplace Modernization and Professional Services.

Well-known for our strengths in system integration and consultation, CTC Global proves to be the preferred IT outsourcing destination for organizations all over Singapore today.

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Planview has one mission: to build the future of connected work. Our solutions enable organizations to connect the business from ideas to impact, empowering companies to accelerate the achievement of what matters most. Planview’s full spectrum of Portfolio Management and Work Management solutions creates an organizational focus on the strategic outcomes that matter and empowers teams to deliver their best work, no matter how they work. The comprehensive Planview platform and enterprise success model enables customers to deliver innovative, competitive products, services, and customer experiences. Headquartered in Austin, Texas, with locations around the world, Planview has more than 1,300 employees supporting 4,500 customers and 2.6 million users worldwide. For more information, visit www.planview.com.

SUPPORTING ORGANISATION

SIRIM is a premier industrial research and technology organisation in Malaysia, wholly-owned by the Minister​ of Finance Incorporated. With over forty years of experience and expertise, SIRIM is mandated as the machinery for research and technology development, and the national champion of quality. SIRIM has always played a major role in the development of the country’s private sector. By tapping into our expertise and knowledge base, we focus on developing new technologies and improvements in the manufacturing, technology and services sectors. We nurture Small Medium Enterprises (SME) growth with solutions for technology penetration and upgrading, making it an ideal technology partner for SMEs.

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HashiCorp provides infrastructure automation software for multi-cloud environments, enabling enterprises to unlock a common cloud operating model to provision, secure, connect, and run any application on any infrastructure. HashiCorp tools allow organizations to deliver applications faster by helping enterprises transition from manual processes and ITIL practices to self-service automation and DevOps practices. 

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IBM is a leading global hybrid cloud and AI, and business services provider. We help clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. Nearly 3,000 government and corporate entities in critical infrastructure areas such as financial services, telecommunications and healthcare rely on IBM’s hybrid cloud platform and Red Hat OpenShift to affect their digital transformations quickly, efficiently and securely. IBM’s breakthrough innovations in AI, quantum computing, industry-specific cloud solutions and business services deliver open and flexible options to our clients. All of this is backed by IBM’s legendary commitment to trust, transparency, responsibility, inclusivity and service.